The pinout can be linear, in two parallel directions, all four sides, or matrix form. LQFP is a low profile (1.4mm) version of the QFP. Mike's Electric Stuff: High voltage, vintage electronics etc. Site design / logo 2023 Stack Exchange Inc; user contributions licensed under CC BY-SA. The number after QFP indicates the . They have a standard lead-frame footprint of 2mm. Most common LGAs are used as a physical interface for microprocessors. Why have the same chip in the same package, but with a different number of pins? The following guide hopes to answer these questions. Quad Flat Packages (QFP) are gull wing packages with leads on all four sides. Nevertheless, we can use both packages in similar applications as they are both low-profile packages. J. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Then you are placing them under pretty high stress. This package is a variant of the CERDIP package. HTQFP48 SOT545-2 Not suitable for wave soldering. These features make them suitable for higher frequency applications. Get the newsletter delivered to your inbox, with helpful tips on PCB assembly and news from WellPCB. LQFP (Low Profile Quad Flat Package) LQFP is a kind of QFP whose package body thickness is 1.4 mm and this is the name used by the Japanese Electronics and Machinery Industry according to the new QFP shape specification. Wettable Flanks QFNs have an elevation reflecting solder wetting. Packages with exposed pads should not be placed opposite to each other on either side of a PCB when doing double-sided mounting. Is it possible to solder LQFP package to board designed for QFP? QFP typically have 32 to 208 pins placed in a pitch of 0.4 to 1 mm. It is an SMD with all DIP pins bent outwards and shrunk down to size. The ppm calculations are at the homogeneous material level and are worst-case ppm for each RoHS substance. Broadly, with the above-mentioned criteria, all different IC packages can be easily distinguished. The extensions shield the leads against any mechanical damage before you solder this package onto a PCB. BT resin, ceramic and polyimide resin carrier contains original components with higher cost while QFP contains plastic molding resin and metal sheet lead frame with low cost. These QFNs are composed of three sections, namely: These QFNs are pretty pricey compared to other QFNs due to their construction. Additionally, you can purchase them in different die types. To achieve this, QFN utilizes SMT (surface-mount technology). Typically 1.4 mm thick. Flip-chip is less expensive molded QFN package that utilizes flip-chip interconnectivity onto copper lead frame. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC). By clicking Post Your Answer, you agree to our terms of service, privacy policy and cookie policy. . So I was thinking that maybe TQFP have the same land pattern as QFP. Exceptions occur for imperial in the two smallest rectangular passive sizes. PG-LQFP-144-22_Package Outline Share. EXAMPLE: Lead (Pb) in leadframe example: (mass of Lead: 0.006273 mg / total mass of leadframe: 62.730001mg) * 1,000,000 = 100 ppm, Quality, reliability & packaging data download. These packages are hermetic. Thermal & mechanical simulation results were performed to prove its advantage over conventional LQFP and LQFP_EP. The leadframe is attached using glass. Though for commercial use, those ICs may be available in surface-mount packages. LQFP is a low profile (1.4mm) version of the QFP. SMT allows automated placement of more components in a smaller area. The ICs, together with other discrete components, are assembled and interconnected on a printed circuit board or a prototyping board to produce an actually functioning electronic circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead. However, the distinguishing factors remain the same as mentioned above. When working with a PCB design or editing software, you may notice that both the LQFP and TQFP have the same footprint. A fourth way to distinguish IC packages is by terminal count. Quad Flat Package with Heat sink LQFP. A QFP IC can have pins anywhere from eight per side (32 total) to upwards of seventy (300+). All measurements below are given in mm. Lightweight and thin package solution. Board Assembly Recommendations (General) Share. Polybrominated diphenyl ethers (PBDE): 0.1% (1000ppm). QFP pins are pretty small, plus they have small spacings. Well, in this article, we shall look at QFN and QFP in detail. You can use an accuracy and precision tool to accurately fit your component, even with the excessive interconnection density issue. LQFP can have higher lead counts, and its leads are longer. These packages allow IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin endproduct profile and portability. QFN packages come in different variations, which include: The plastic molded QFN is, interestingly, one of the cheapest QFN that you can find in the market. 05_00 | Nov 26, 2021 | PDF | 122 kb. Pins on a QFP IC are usually spaced anywhere from 0.4mm to 1mm apart. Then, a punch tool splits the molded cavity. Solder these replacement pins onto a larger pad on the print circuit board with a large copper area. Low profile and thin quad flat packages (QFP) are classified by Maximum Seated height according to JEDEC definition: Low type (>1.20 mm and <=1.70 mm) and thin type (>1.00mm and <=1.20 mm) but the pitch and package size can vary within each. TQFP packages range from 32 pins with a 0.8mm lead pitch, in a package 5mm by 5mm by 1mm thick, to 256 pins, 28mm square, 1.4mm thick and a lead pitch of 0.4mm.[2]. Also, this leadless IC package is effective for connecting the IC's silicon die to the printed circuit board. However, you still need to place the component carefully. 05_00 | Sep 22, 2022 | PDF | 3.04 mb. As its name implies, the LQFP (low-profile quad flat ) is a low-profile quad version of the regular quad flat package. For the digital logic technology, see, Last edited on 17 February 2023, at 23:37, Learn how and when to remove this template message, " 4244.256-3 ( CQFP)", HVQFN Documentation at NXP Semiconductors. [33], Mostly resistors and diodes; barrel shaped components, dimensions do not match those of rectangular references for identical codes.[51]. What does QFN stand for? Just as the name dictates, air cavity QFNs features an air cavity in their package. A variety of techniques for interconnecting several chips within a single package have been proposed and researched: Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. Lead pitch values used by LQFP's vary: 0.4mm, 0.5 mm, 0.65 mm, and 0.80 mm. 04_00 | Jan 20, 2022 | PDF | 110 kb . The Chinese meaning of this technology is called square quad flat package technology (Plastic Quad Flat Package). By definition, a QFP with 256 pins means that it would typically have around sixty-four pins protruding on either side of the package. How can we achieve this challenging feat? Accuracy and precision are pretty crucial for this part. Package Size (mm) Lead Count LQFP 7 x 7 32, 48, 64 10 x 10 44, 64, 80 14 x 14 64, 80, 100, 120 20 x 20 144, 176 24 x 24 176 28 x 28 208 LQFP-ep 10 x 10 64 Board Assembly Recommendations (QFP) Share. The QFP means (quad flat pack). QFN is also a lead frame-based package known as a CSP (Chip Scale Package) because it lets you contact and see lead even after assembly. Mercury (Hg): 0.1% (1000ppm), 3. So careful designing and routing are pretty essential to ensure that you do not violate any designing rule. Particle size of this alloy must be suitable for solder-stencil apertures dimensions printing. Yes: Fully compliant to TI Green definition. Lead counts range from 32 to 176. Pads are spaced along the sides of the IC with an exposed die that can be used as ground. Package. Chip-size package (CSP) developed by National Semiconductor. QFP vs. QFN: QFP Packages QFP is an acronym for Quad Flat Package. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media Privacy Policy, Have a technical question about an article or other engineering questions? 0.1in (2.54mm) pin spacing, rows 0.3in (7.62mm) or 0.6in (15.24mm) apart. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54mm / 0.0254 = 100 mil). This makes it easier to mount than TQFP. QFP ICs might have anywhere from eight pins per side (32 total) to upwards of seventy (300+ total). QFNs perform well when they hit high-volume, low-mix products. The SMD components themselves have smaller form-factor and have either smaller or no leads. QFP packages provide the same benefit of the metric TQFP packages with 1.4 mm body thickness (less than 1.7mm, but more than 1.2mm), but are thinner and have a standard lead-frame footprint (0.2mm). quad-flat no-leads Your happiness as a customer is my priority! Some manufacturers do not give package information in every datasheet but instead have a catalogue of land patterns in a different document. It only takes a minute to sign up. A low-profile quad flat package (LQFP) is a surface mount integrated circuit package format with component leads extending from each of the four sides. TI offers 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package[5] E.g. TI products that are compliant to RoHS requirements are also fully compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide). QFP solder joint temperature can be affected by a couple of things: For power packages whereby shortage and leakage current below the QFP are a factor to, you should solder using less flux spread. There are many IC packages, and most of the ICs come in more than one package. However, some smaller QFPs might have only thirty-two pins, which means they have eight pins on either side. So now you know why it is known as a punch-type QFN. TQFP package having total height less than 1.2mm, said package named Thin profile Quad Flat Package. These packages are QFPs with a pretty fine pin pitch just as their name dictates. Posted on June 13, 2006 at 11:33 . They are thinner, having a body thickness of only 1.44mm, which means that they can be utilized in components that have height issues. Like Liked Unlike. QFP (Quad Flat Package) Definition. The leadless types have electrode pads as the terminals for the connections. TQFP is short for Thin Quad Flat Package, a type of surface-mounted integrated circuit package with connections all around the periphery. There are many different types of IC packages and different ways of classifying these package types. We shall also answer questions such as if the two have any significant differences, which of the two should you consider for your project? QFPs come in two shape variations, rectangular and square: QFP packages have two sections: the top and bottom sections. After that, sort the sawn types to conclude the process of creating a sawn-type QFN package. Metric Quad Flat Package. In this step, we seek to confirm the quality of the solder. Non-standard DIP with smaller 0.07in (1.78mm) pin spacing. E.g. Low Profile Quad Flat Pack (LQFP) is a surface-mount IC package with leads extending from all around four sides of the package body. Can I tell police to wait and call a lawyer when served with a search warrant?